JPS6362318B2 - - Google Patents

Info

Publication number
JPS6362318B2
JPS6362318B2 JP58149742A JP14974283A JPS6362318B2 JP S6362318 B2 JPS6362318 B2 JP S6362318B2 JP 58149742 A JP58149742 A JP 58149742A JP 14974283 A JP14974283 A JP 14974283A JP S6362318 B2 JPS6362318 B2 JP S6362318B2
Authority
JP
Japan
Prior art keywords
flux
brazing
present
tdp
wax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58149742A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5954496A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5954496A publication Critical patent/JPS5954496A/ja
Publication of JPS6362318B2 publication Critical patent/JPS6362318B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Inert Electrodes (AREA)
JP58149742A 1982-09-14 1983-08-18 ろう付け方法及びろう付けペ−スト Granted JPS5954496A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/417,966 US4504007A (en) 1982-09-14 1982-09-14 Solder and braze fluxes and processes for using the same
US417966 1982-09-14

Publications (2)

Publication Number Publication Date
JPS5954496A JPS5954496A (ja) 1984-03-29
JPS6362318B2 true JPS6362318B2 (en]) 1988-12-01

Family

ID=23656090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58149742A Granted JPS5954496A (ja) 1982-09-14 1983-08-18 ろう付け方法及びろう付けペ−スト

Country Status (4)

Country Link
US (1) US4504007A (en])
EP (1) EP0103213B1 (en])
JP (1) JPS5954496A (en])
DE (1) DE3376472D1 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0450625U (en]) * 1990-09-04 1992-04-28

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US4632295A (en) * 1985-08-12 1986-12-30 International Business Machines Corporation Reduction atmosphere workpiece joining
US4728023A (en) * 1986-01-22 1988-03-01 Mcdonnell Douglas Corporation Rosin-free solder composition
US4759490A (en) * 1986-10-23 1988-07-26 Fujitsu Limited Method for soldering electronic components onto a printed wiring board using a solder paste
GB8628916D0 (en) * 1986-12-03 1987-01-07 Multicore Solders Ltd Solder composition
JPH01143796A (ja) * 1987-11-27 1989-06-06 Calsonic Corp アルミニウム材のろう付方法
JP2592471B2 (ja) * 1987-11-27 1997-03-19 カルソニック株式会社 アルミニウム材のろう付方法
JP2571798B2 (ja) * 1987-11-27 1997-01-16 カルソニック株式会社 アルミニウム材のろう付方法
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating
EP0345485A1 (en) * 1988-06-08 1989-12-13 International Business Machines Corporation Solder paste for use in a reducing atmosphere
US4921157A (en) * 1989-03-15 1990-05-01 Microelectronics Center Of North Carolina Fluxless soldering process
JPH04333390A (ja) * 1991-05-07 1992-11-20 Nippon Genma:Kk アルミニウムろうペースト
GB9126497D0 (en) * 1991-12-13 1992-02-12 Cookson Group Plc Paste,ink or cream formulations for use in the electronics industry
US5390845A (en) * 1992-06-24 1995-02-21 Praxair Technology, Inc. Low-bridging soldering process
US5344592A (en) * 1993-02-16 1994-09-06 E. I. Du Pont De Nemours And Company Organic vehicle for electronic composition
US5398865A (en) * 1993-05-20 1995-03-21 Electrovert Ltd. Preparation of surfaces for solder joining
US5407121A (en) * 1993-11-19 1995-04-18 Mcnc Fluxless soldering of copper
US5499754A (en) * 1993-11-19 1996-03-19 Mcnc Fluxless soldering sample pretreating system
US5549927A (en) * 1994-03-01 1996-08-27 Modine Manufacturing Company Modified substrate surface and method
US5431328A (en) * 1994-05-06 1995-07-11 Industrial Technology Research Institute Composite bump flip chip bonding
US5707902A (en) * 1995-02-13 1998-01-13 Industrial Technology Research Institute Composite bump structure and methods of fabrication
US5786559A (en) * 1995-10-17 1998-07-28 Meyer Tool, Inc. Weld-braze process
US6053396A (en) * 1996-11-08 2000-04-25 Toyo Riken Corporation Scale formation-inhibitory agents used in welding treatments and method for inhibiting formation of a scale in a welding treatment of metal parts
JP3462025B2 (ja) * 1996-12-16 2003-11-05 千住金属工業株式会社 ソルダペースト
GB9801996D0 (en) * 1998-01-30 1998-03-25 Boc Group Plc Furnace brazing
US6234381B1 (en) * 1998-04-14 2001-05-22 Denso Corporation Water-base binder for aluminum material brazing, brazing composition, and method of brazing with the composition
US6270949B1 (en) 1998-08-11 2001-08-07 International Business Machines Corporation Single component developer for copolymer resists
US6426177B2 (en) 1998-08-11 2002-07-30 International Business Machines Corporation Single component developer for use with ghost exposure
JP2001332575A (ja) * 2000-05-19 2001-11-30 Sony Corp フラックス洗浄方法及び半導体装置の製造方法
US6375060B1 (en) * 2000-07-19 2002-04-23 The Boeing Company Fluxless solder attachment of a microelectronic chip to a substrate
US6875268B2 (en) * 2001-09-26 2005-04-05 Hrl Laboratories, Llc Method of improving a surface of a substrate for bonding
EP1361437A1 (en) * 2002-05-07 2003-11-12 Centre National De La Recherche Scientifique (Cnrs) A novel biological cancer marker and methods for determining the cancerous or non-cancerous phenotype of cells
US7638727B2 (en) * 2002-05-08 2009-12-29 Btu International Inc. Plasma-assisted heat treatment
US20060057016A1 (en) * 2002-05-08 2006-03-16 Devendra Kumar Plasma-assisted sintering
US7432470B2 (en) 2002-05-08 2008-10-07 Btu International, Inc. Surface cleaning and sterilization
US20060233682A1 (en) * 2002-05-08 2006-10-19 Cherian Kuruvilla A Plasma-assisted engine exhaust treatment
US7465362B2 (en) * 2002-05-08 2008-12-16 Btu International, Inc. Plasma-assisted nitrogen surface-treatment
US20050233091A1 (en) * 2002-05-08 2005-10-20 Devendra Kumar Plasma-assisted coating
US7560657B2 (en) * 2002-05-08 2009-07-14 Btu International Inc. Plasma-assisted processing in a manufacturing line
US7494904B2 (en) * 2002-05-08 2009-02-24 Btu International, Inc. Plasma-assisted doping
IL164824A0 (en) * 2002-05-08 2005-12-18 Dana Corp Plasma catalyst
US20060228497A1 (en) * 2002-05-08 2006-10-12 Satyendra Kumar Plasma-assisted coating
US20060062930A1 (en) * 2002-05-08 2006-03-23 Devendra Kumar Plasma-assisted carburizing
US20060237398A1 (en) * 2002-05-08 2006-10-26 Dougherty Mike L Sr Plasma-assisted processing in a manufacturing line
WO2003095237A1 (en) * 2002-05-08 2003-11-20 Leonhard Kurz Gmbh & Co. Kg Method of decorating large plastic 3d objects
US7498066B2 (en) * 2002-05-08 2009-03-03 Btu International Inc. Plasma-assisted enhanced coating
US7445817B2 (en) * 2002-05-08 2008-11-04 Btu International Inc. Plasma-assisted formation of carbon structures
US7497922B2 (en) * 2002-05-08 2009-03-03 Btu International, Inc. Plasma-assisted gas production
JP2004095770A (ja) * 2002-08-30 2004-03-25 Tokyo Electron Ltd 処理装置
US6786391B2 (en) * 2002-10-16 2004-09-07 Kac Holdings, Inc. Method of controlling solder deposition utilizing two fluxes and preform
US7189940B2 (en) 2002-12-04 2007-03-13 Btu International Inc. Plasma-assisted melting
US20080129208A1 (en) * 2004-11-05 2008-06-05 Satyendra Kumar Atmospheric Processing Using Microwave-Generated Plasmas
US20070051774A1 (en) * 2005-09-06 2007-03-08 Stipp John N Method of controlling solder deposition on heat spreader used for semiconductor package
US8685599B1 (en) * 2011-02-24 2014-04-01 Sandia Corporation Method of intrinsic marking
CN105032727A (zh) * 2013-05-30 2015-11-11 卢卡斯米尔霍特公司 用于焊剂涂布钎焊预制件和分离式部件的方法
CN112958940B (zh) * 2021-03-23 2022-06-28 贵研铂业股份有限公司 银基/铜基/金基钎料焊膏、制备方法及焊接工艺

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US2429033A (en) * 1942-05-30 1947-10-14 Lucas Ltd Joseph Soldering flux
US2566339A (en) * 1949-07-27 1951-09-04 Glidden Co Brazing paste
US2664370A (en) * 1951-12-20 1953-12-29 Chester A Snell Soldering flux
US2908072A (en) * 1956-06-25 1959-10-13 Glidden Co Brazing paste and process of brazing
US3040781A (en) * 1958-04-15 1962-06-26 Martin Marietta Corp Solderable coating
US3294951A (en) * 1963-04-30 1966-12-27 United Aircraft Corp Micro-soldering
US3281222A (en) * 1963-06-12 1966-10-25 Bell Telephone Labor Inc Activated rosin fluxes and cored solders made therefrom
US3305406A (en) * 1964-04-06 1967-02-21 Western Electric Co Method of fluxing an article to be soldered with noncorrosive fluxing compositions
US3264146A (en) * 1965-09-10 1966-08-02 Continental Can Co Organic flux compositions and method of using same
US3495322A (en) * 1967-07-20 1970-02-17 Motorola Inc Process for bonding a silicon wafer to a ceramic substrate
US3697333A (en) * 1968-05-02 1972-10-10 Albert Hoeffleur Welding paste for resistance welding copper parts
US3448512A (en) * 1968-08-26 1969-06-10 Electronic Eng Co California Method of soldering
US3620799A (en) * 1968-12-26 1971-11-16 Rca Corp Method for metallizing a ceramic body
US3832242A (en) * 1970-07-23 1974-08-27 Scm Corp Brazing and solder compositions comprising a chelating agent
US3791027A (en) * 1971-06-30 1974-02-12 Ibm Soldering method
JPS556480B2 (en]) * 1971-09-07 1980-02-16
US3937387A (en) * 1974-03-12 1976-02-10 Nasa Method of fluxless brazing and diffusion bonding of aluminum containing components
US3986899A (en) * 1974-06-07 1976-10-19 Scm Corporation Atomized copper brazing paste
JPS514191A (en) * 1974-06-26 1976-01-14 Toray Industries Ipushiron kapurorakutamuno seizoho
US4194931A (en) * 1977-05-16 1980-03-25 Western Electric Co. Soldering flux
DE2724641C2 (de) * 1977-06-01 1986-04-03 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Aufbringen von Lötungen auf Goldschichten
US4113525A (en) * 1977-06-30 1978-09-12 Chevron Research Company Carboxylic acid-containing wax fluxes
US4216035A (en) * 1977-12-23 1980-08-05 International Business Machines Corporation Removable protective coating and process of using same
GB1594804A (en) * 1978-05-23 1981-08-05 Multicore Solders Ltd Soft soldering
US4221047A (en) * 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
ES490073A0 (es) * 1979-04-06 1981-05-16 Johnson Matthey Co Ltd Procedimiento para la obtencion de una composicion para sol-dar.
JPS5831274B2 (ja) * 1980-05-02 1983-07-05 三井金属鉱業株式会社 ロウ付用金属ペ−スト組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0450625U (en]) * 1990-09-04 1992-04-28

Also Published As

Publication number Publication date
EP0103213A1 (en) 1984-03-21
EP0103213B1 (en) 1988-05-04
JPS5954496A (ja) 1984-03-29
US4504007A (en) 1985-03-12
DE3376472D1 (en) 1988-06-09

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